Ldo No Output Capacitor

Energy harvesting IC

Operating at an ultra-low current level, the IC accepts energy from a variety of poorly regulated energy harvesting sources with output levels ranging from 1 μW to 100 mW. Examples include light (captured by photovoltaic cells), vibration (captured by a piezoelectric element), heat (captured by a thermoelectric generator) and RF (eg, near-field communications (NFC)). The MAX17710 integrates a programmable input boost regulator and needs no expensive external components to charge a MEC with energy sources as low as 0,8 V. It protects the MEC by using a linear shunt series regulator. A low quiescent current, adjustable low-dropout linear regulator (LDO) with selectable voltages of 3,3 V, 2,3 V or 1,8 V allows the device to adapt to a variety of loads. Packaged in a low-profile 0,5 mm TQFN, the chip enables thin, card-like applications. It will also be available in wafer form to enable even thinner form factors. The device also works in power bridging applications where energy harvesting is not necessarily used. In such applications, infrastructure power (from the grid or a larger battery) is typically available to power the system and can trickle-charge an MEC for memory or RTC backup power. In the event of a loss of grid power or a system brownout during replacement of the larger system battery, the stored energy in the MEC continues to power volatile memory and/or an RTC for hours, days or even weeks. This solution displaces bulky coin cells and supercapacitors that have high self-discharge currents and limited life, especially at elevated temperatures. The MAX17710 is targeted at powered smartcards, real-time clock (RTC)/memory backup applications and wireless sensor networks. Examples of wireless sensor networks include remote applications like irrigation valve control, building energy management, machine monitoring systems, asset tracking, biometric security systems, medical applications and a myriad of portable consumer electronics.

990FXA-UD7 Review (Analysis, Ripple Testing, Benchmarks)

Welcome! Today I will take an in-depth look into GIGABYTE’s top of the line 990FX Chipset offering, the 990FXA-UD7. The new UD7 has the AMD 990FXA chipset, which supports AMD’s future Zambezi processors, better known as Bulldozer. There has been a lot of hype over the new AMD platform, as Bulldozer is supposed to bring AMD back to the top, and AMD is bringing back its almighty FX lineup. Only time will tell how it will pan out for AMD, but motherboard manufacturers aren’t waiting around. The 990FX chipset paired with the SB950 offers some great features; biggest of them all is SLI support and Hyper Transport 3.1. The 990FX chipset itself has 42 PCI-E 2.0 lanes, 32 of which are for the GPUs. To top it off the 990FXA-UD7 can support 4-way SLI, something that no other 990FX chipset board can do at the moment. Now while on the Intel side 4-way SLI needs NF200 Chipsets, on this AMD platform we can do it without any added latency. Of course you will be running 4-way at 8x per slot. Now this platform is built for the future processors, so there are a few features that aren’t supported by AMD’s current top of the line Phenom 2 X6 1100T which we will use in the review today. One such example is the HyperTransport 3.1, which runs at 6400GT/s opposed to HyperTransport 3.0 at 5200GT/s. Another example, and one worth noting is the vdroop that many have encountered with this motherboard. GIGABYTE states that it’s design (vdroop in particular) strictly adheres to AMD’s AM3+ guidelines for the Zambezi processors. Today we will venture far into the deep and darkest corners of the 990FXA-UD7, and uncover whatthis board is really made of. This review features a new section that I have been working hard on developing, the VRM testing section. We will use a DSO(digital sampling oscilloscope) hooked up to a separate system, to analyze peak2peak voltage (ripple), as well as run a pass fail test to see how often the ripple measurements surpass a set point.

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